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| Datasheet File OCR Text: |
| P8 Heatsink For capsule devices Dimensions in mm P8 Features Dimensions in mm 1 17-03-2005 ADR (c) by SEMIKRON P8 Fig.1 Thermal resistance vs.dissipated power Fig.5aThermal resistance and pressure drop vs.air flow Fig.5bThermal resistance and pressure drop vs.air flow Fig.9a Transient thermal impedance vs.time Fig.9b Transient thermal impedance vs.time Fig.9c Transient thermal impedance vs.time 2 17-03-2005 ADR (c) by SEMIKRON P8 Fig.11a Transient thermal impedance vs.time Fig.11b Transient thermal impedance vs.time Fig.11c Transient thermal impedance vs.time Fig.11d Transient thermal impedance vs.time 3 17-03-2005 ADR (c) by SEMIKRON P8 Dimensions in mm 4 17-03-2005 ADR (c) by SEMIKRON |
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